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Thermosonic bonding combines the best properties of ultrasonic and thermocompression bonding. The bonding procedure is the same as in thermocompression bonding, except that the substrate is maintained at a temperature of approximatley 150℃. Ultrasonic vibration causes the metal to flow under pressure and form a strong weld. The symmetrical bonding tool permits movement in any direction following the nailhead bond. Thermosonic bonding can be easily automated, and computer-controlled thermosonic bonders can produce 5 to 10 bonds per second.
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